Slurry for the stock polishing SiC wafer

dvantage:

 1. High removal rate (>2.5μm/h)

2. Good surface quality: smooth, no obvious scratch.

3. Long life.

Application: High-purity semi-insulator 4H-SiC, N-type 4H-SiC wafer polishing, etc.

Slurry for the final polishing of SiC wafer

Advantage:

 1. Good surface quality: surface roughness (Ra) <0.15nm. 

2. High removal rate (>1m/h).

3. Easy to be cleaned.

Application: High-purity semi-insulator 4H-SiC, N-type 4H-SiC wafer fine polishing, etc.